Samsung Electro-Mechanics announced it will showcase its next-generation semiconductor packaging substrate technology at the KPCA Show 2026, taking place from September 9 to 11 at the Songdo Convensia in Incheon.
The KPCA Show is a leading exhibition in South Korea where domestic and international semiconductor substrate, packaging, material, and equipment companies share the latest technologies and market trends in the industry.
At the exhibition, Samsung Electro-Mechanics will present five products, including 2.5D and 2.1D packaging substrates, glass substrates, flip-chip ball grid arrays (FCBGA) for automotive applications, and ultra-thin chip scale package (UTCSP) substrates. The company aims to expand the application areas of high-value packaging substrates to include AI, servers, data centers, mobile devices, and autonomous driving.
Semiconductor packaging substrates are essential components that connect high-density semiconductor chips to motherboards, facilitating the transmission of electrical signals and power. With the increasing computational performance of AI accelerators and the growing use of high-bandwidth memory (HBM), the role of packaging substrates has become more critical. The integration of multiple high-performance chips into a single package necessitates large-area, multi-layer designs, fine circuits, and high-density interconnection technologies.
Samsung Electro-Mechanics will showcase technologies that reduce substrate warping due to large-area and multi-layer designs in its 2.5D packaging substrates, as well as high-speed signal transmission and high-density interconnection technologies. The company will also introduce a 2.1D packaging substrate that connects semiconductor chips without a silicon interposer, addressing the high-speed and high-density requirements of AI semiconductors through fine circuits and high-density interconnection technologies.
The glass substrate technology, which is gaining attention as a next-generation packaging substrate, will also be exhibited. By using glass as the core material instead of traditional organic materials, glass substrates can reduce warping in large substrates and enhance dimensional stability. This technology also allows for fewer substrate layers while improving signal characteristics and power efficiency. Samsung Electro-Mechanics will present key technologies, including creating fine connection pathways in glass and filling them with metal, as well as precision surface processing.
The company is also diversifying its application areas. The UTCSP for data centers and mobile devices features a coreless structure that reduces substrate thickness and employs fine bond finger technology. Additionally, UTC packaging substrates for laptop and tablet CPUs and co-packaged substrates for smartphones will be showcased.
For the autonomous driving market, Samsung Electro-Mechanics will present automotive packaging substrates. These substrates require not only large-area, multi-layer, and fine circuit technologies but also high reliability to operate stably under high temperatures, high humidity, and repeated temperature changes. The company plans to expand its business into the automotive market based on high-functionality substrate technologies, including multi-chip structures.
Joo Hyuk, Vice President of Samsung Electro-Mechanics and head of the Package Solution Division, stated, "As the markets for AI accelerators, servers, and autonomous driving grow, the role and technical complexity of packaging substrates are rapidly increasing. We will enhance large-area, multi-layer, and ultra-fine circuit technologies and next-generation packaging technologies to respond to the high-end semiconductor packaging substrate market."
* This article has been translated by AI.
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