Kwak Dong-sin, Chairman of Hanmi Semiconductor, is strengthening his commitment to responsible management by purchasing an additional $4.2 million in company shares.
On July 2, Hanmi Semiconductor announced that Kwak plans to buy $4.2 million worth of company shares using his personal funds. The acquisition is scheduled for July 30.
Once this purchase is completed, Kwak's ownership stake will rise to 33.61%. Since 2023, he has consistently bought back shares, and with this latest acquisition, his total investment will reach $6.3 million (730,345 shares). Last month, he also acquired an additional $6 million in company shares.
This share buyback is seen as a signal of the management's confidence in the growth of the AI semiconductor and advanced packaging markets.
Hanmi Semiconductor plans to establish a local subsidiary, Hanmi USA, in San Jose, California, by the end of this year to intensify its efforts in the U.S. semiconductor market. The strategy aims to enhance technical support and sales capabilities for local clients in line with the growing trend of semiconductor production in the U.S.
In the U.S., companies like Micron, SK Hynix, Amkor Technology, and Intel are expanding their local production facilities, benefiting from the investment incentives provided by the CHIPS Act.
Hanmi Semiconductor also views Elon Musk's semiconductor production project, Terafab, as a potential growth driver. Terafab is a large-scale project being developed in Austin, Texas, aimed at producing AI semiconductors for SpaceX, Tesla, and xAI, with a total investment of $119 billion (approximately 177 trillion won) and a target operational date of 2028.
The company holds the top global market share in the TC bonder sector, a key equipment for producing high-bandwidth memory (HBM). As mass production of HBM4 ramps up, Hanmi is expanding the supply of its 'TC Bonder 4' for HBM4 and plans to release a prototype of its second-generation hybrid bonder equipment for next-generation HBM production this year.
The company is also accelerating the development of next-generation equipment. It is currently working on a 'Wide TC Bonder,' aiming for a release in the first half of next year to meet the growing demand for AI semiconductor packaging.
In addition, Hanmi Semiconductor is expanding its business in the system semiconductor packaging market. Last month, it introduced two new 2.5D packaging equipment models, 'FC Bonder 3.5' and '2.5D TC Bonder 4.0,' and is increasing supply to global foundries and OSAT companies.
The company is also making strides in the aerospace sector. It has begun supplying its newly launched EMI Shield 2.0X series, designed for electromagnetic shielding, to global aerospace companies, marking its entry into a new market.
A Hanmi Semiconductor representative stated, "Kwak Dong-sin's additional share purchase demonstrates confidence in our long-term growth strategy, including the supply goals for Terafab in the U.S., and our commitment to responsible management. We will continue to strengthen our global leadership in the AI semiconductor and advanced packaging markets."
* This article has been translated by AI.
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