Samsung Electronics signed a strategic memorandum of understanding (MOU) with global AI semiconductor company Broadcom on July 24 during the AI Summit held in San Francisco, aimed at building next-generation AI infrastructure.
The AI Summit was attended by Han Jin-man, president of Samsung's Foundry Business, and Hock Tan, CEO of Broadcom, along with executives from both companies and government officials.
Samsung plans to expand its collaboration with Broadcom based on its unique "one-stop turnkey solution" that encompasses memory, foundry, and advanced packaging, aiming to provide differentiated customer value in the next-generation AI semiconductor market.
Under this agreement, the two companies will pursue strategic cooperation worth over $200 billion in the memory and foundry sectors over the next five years, further enhancing their technological collaboration in AI semiconductors.
Broadcom Strengthens AI Accelerator Competitiveness with Advanced HBM Solutions
As major global tech companies rapidly adopt custom AI accelerators (ASICs), this partnership is significant as it combines Broadcom's leadership in custom semiconductor design with Samsung's expertise in memory, manufacturing, and packaging technologies to enhance next-generation AI semiconductor competitiveness.
Samsung will supply advanced memory solutions, including High Bandwidth Memory (HBM), leveraging its world-class memory technology to enhance the performance and competitiveness of Broadcom's AI accelerators.
Following the industry-first mass production of HBM4, which applies 1c DRAM and 4nm base die technology in February, Samsung also supplied HBM4E samples to customers in May, continuing its leadership in next-generation HBM technology.
Samsung's HBM is expected to serve as a core memory solution that maximizes the performance of Broadcom's AI accelerators, supporting the competitiveness of next-generation AI infrastructure.
Enhancing Broadcom's AI Chip Competitiveness with 2-Nanometer Foundry and Advanced Packaging
In the foundry sector, Samsung will apply advanced foundry processes below 2 nanometers to Broadcom's next-generation communication semiconductor solutions, enhancing product competitiveness.
Additionally, Samsung will support the implementation of high-performance, high-efficiency AI semiconductors through advanced packaging technology based on 2-nanometer processes, providing Broadcom with differentiated AI semiconductor solutions.
Samsung will also closely integrate the entire process from chip design to advanced packaging and mass production, optimizing semiconductor design and processes to shorten product development timelines while maximizing performance and power efficiency.
With this technological competitiveness, Samsung plans to continue expanding its collaboration with Broadcom in the next-generation AI semiconductor field and actively explore new business opportunities in the rapidly growing AI and high-performance computing markets.
Vice Chairman Jeon Young-hyun: "Integrated Semiconductor Solutions are Key Competitiveness in the AI Era"
This agreement is seen as a strategic partnership that strengthens cooperation between the two companies across key semiconductor technologies—memory, foundry, and advanced packaging—aimed at enhancing the competitiveness of the next-generation AI semiconductor ecosystem.
Jeon Young-hyun, vice chairman of Samsung's Device Solutions division, stated, "In the AI era, semiconductor solutions that integrate memory, logic, and advanced packaging are crucial. By expanding our collaboration with Broadcom, we will accelerate the development of future AI infrastructure and provide greater value to our customers."
Charlie Kawas, president of Broadcom's Semiconductor Solutions Group, remarked, "As AI infrastructure rapidly expands, close collaboration across the semiconductor ecosystem is becoming increasingly important. Through our partnership with Samsung, we aim to create next-generation solutions optimized for the diverse demands of the market."
Through this agreement, Samsung aims to elevate its leadership in next-generation semiconductor technology and manufacturing capabilities, driving innovation in the global AI semiconductor ecosystem.
* This article has been translated by AI.
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