The 2026 Next-Generation Semiconductor Packaging Industry Exhibition opened on August 26 at the Suwon Convention Center.
This event, co-hosted by Suwon City and Gyeonggi Province, aims to share the latest trends and future visions in advanced packaging technology while promoting technical exchanges among semiconductor companies and experts.
Suwon Mayor Lee Jae-jun, during the opening ceremony of the Next-Generation Semiconductor Packaging Industry Exhibition (ASPS) and the International Semiconductor Executive Summit (ISIG), stated, "We are in an era where semiconductor packaging technology determines the competitiveness of artificial intelligence (AI) semiconductors. I hope this exhibition will spark innovation in the packaging industry and serve as a foundation for growth."
He added, "Suwon is transitioning into a 'high-tech research city' where research, validation, and startups are organically conducted, focusing on semiconductors, AI, and biotechnology. We will support technological innovation in small and medium-sized enterprises to lay the groundwork for a global high-tech research city."
About 180 companies, including Samsung Electronics and SK Hynix, are participating in the exhibition, operating 400 booths. They will showcase advanced technologies related to semiconductor packaging, testing equipment, materials, components, and technical solutions.
Packaging is a crucial post-process technology that connects and integrates semiconductor chips at high density, enhancing performance and power efficiency. It is recognized as a key technology that will lead the era of AI semiconductors.
The exhibition features an industry showcase, a semiconductor packaging forum, purchasing consultations, a job fair, and company-specific technical seminars.
The International Semiconductor Executive Summit (ISIG) will see executives from global semiconductor companies discussing the roadmap for next-generation semiconductor core technologies and global collaboration strategies.
A forum on semiconductor packaging trends, themed 'In the Age of AI, a Major Shift from Chips to Systems - The Transformation of Semiconductor Packaging,' was also held. Presenters introduced innovative directions for the AI semiconductor packaging value chain, which connects the stages from product and service creation to delivery to customers.
Speakers included Freddy Gavey, a professor at Hebrew University of Jerusalem (geopolitics of AI supremacy and chiplet/advanced packaging), Jo Jin-woo, director at Texas Instruments (TI) Korea (technology convergence of GaN power semiconductors and advanced packaging for AI data center innovation), Im Yong-woo, commercial attaché at the Quebec Government Office in Korea (introduction of the Quebec semiconductor ecosystem and collaboration opportunities), and Lee Hee-seok, a senior official at Samsung Electronics (packaging for AI and AI for packaging).
Suwon City is also operating a joint pavilion, featuring three companies: Opts Co., Metasol Co., and MSTech Co., which are showcasing their products and technologies. Suwon City is promoting investment sites and incentives for attracting investment.
The Suwon Free Economic Zone is being developed in the western Suwon area (Suwon R&D Science Park, Tapdong Innovation Valley), and the city is pursuing projects to attract investment to become a hub for R&D in advanced industries such as semiconductors and biotechnology.
* This article has been translated by AI.
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