LG Innotek is making strides to secure its position in the semiconductor packaging market by showcasing key technologies for next-generation substrates.
The company is participating in the KPCA Show 2026, the largest PCB and semiconductor packaging exhibition in South Korea, held at the Incheon Songdo Convensia starting September 9.
At the event, LG Innotek is unveiling its high-performance 'Flip Chip-Ball Grid Array' (FC-BGA) designed for artificial intelligence (AI) accelerators. This large-area substrate, exceeding 100mm on one side, integrates core technologies for ultra-fine circuit implementation and high-layer stacking. The company plans to begin mass production of this high-value FC-BGA for AI learning and inference in 2027.
Also featured is the chip embedding technology, which incorporates chips within the substrate, achieving both reduced power loss and improved signal transmission performance.
Additionally, LG Innotek is introducing its glass substrate technology, currently under development with a target for mass production in 2028. This next-generation solution minimizes warping and circuit distortion by replacing the core layer with glass.
In the package substrate sector, the company is displaying its global-leading RF-SiP substrate and FC-CSP substrate. The Cu-Post (copper pillar) method applied to communication semiconductor substrates has reduced the spacing between solder balls by approximately 20%, enhancing circuit integration. The use of high thermal conductivity copper has also significantly improved heat dissipation issues.
In the tape substrate zone, LG Innotek is showcasing display substrates such as COF and 2-metal COF, along with the smart IC substrate 'ECONOVA.' ECONOVA has received acclaim in the European market for its environmentally friendly new material that achieves high performance without precious metal plating processes.
George Tae, head of the Package Solutions Division, emphasized, "We will change the paradigm of the substrate market with innovative products. This exhibition allows attendees to intuitively see LG Innotek's substrate technology across various industries, including AI, smartphones, and mobility."
* This article has been translated by AI.
Copyright ⓒ Aju Press All rights reserved.