Industry

  • Samsung Elec on track roll out HBM4 chips this month
    Samsung Elec on track roll out HBM4 chips this month SEOUL, February 08 (AJP) - Samsung Electronics is set to begin mass shipments of the the sixth generation high bandwidth memory chips dubbed HBM4 later this month, according to industry sources Sunday. The chips will be rolled out from the third week of February after the Lunar New Year holiday break, thrusting the HBM laggard into the front tier as HMB4 is expected to become the standard from next-generation AI chips. The shipment schedule has been finalized to align with the February 8, 2026