The company said Wednesday it will exhibit solutions for high-bandwidth memory (HBM) and other AI chips at the three-day show, which runs from Sept. 2 to 4 at the Taipei Nangang Exhibition Center.
SEMICON Taiwan is one of the world's leading trade fairs for semiconductor technology, drawing chipmakers, outsourced assembly and test firms, and substrate and packaging players.
LG Chem will display materials targeting the expansion of the AI chip and high-performance computing markets. Its Advanced Package Zone will feature copper clad laminate, glass core solutions, build-up film and dry film solder resist, among other materials used in cutting-edge packaging processes.
A separate Power Package Zone will highlight conductive sintering paste, thermal interface materials and copper metal foam-based thermal management devices, which the company said help boost chip performance by improving heat control in power semiconductors for AI data centers.
Through the exhibition, LG Chem aims to deepen ties with major chipmakers and forge new projects, accelerating growth in its semiconductor materials business as demand for high-performance materials climbs.
"Customer demand for high-performance materials is rising as the AI chip and advanced packaging markets expand," LG Chem Chief Executive Kim Dong-choon said.
"We will broaden cooperation with semiconductor clients on the strength of a differentiated materials portfolio and actively seize growth opportunities in the future chip market."
AJP Takeaways
• LG Chem is pushing deeper into semiconductor materials, using SEMICON Taiwan to court chipmakers, OSAT firms and packaging players for its AI-chip and advanced-packaging portfolio.
• The lineup spans HBM-related advanced packaging (copper clad laminate, glass core, build-up film, dry film solder resist) and power-chip materials (sintering paste, thermal interface materials, copper metal foam), targeting the AI and HPC buildout at data centers.
• The move fits a broader race among Korean chemical makers to convert materials expertise into higher-margin chip-supply-chain revenue as AI demand reshapes the market.
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