LG Innotek announced that Jo Ji-tae, head of the Package Solution Division, received the Silver Tower Industrial Medal at the 21st Electronics and IT Day ceremony held at COEX in Samseong-dong, Seoul.
Established in 2005, Electronics and IT Day aims to elevate the status of the electronics and IT industry and recognize individuals who have contributed to national economic development.
Jo was recognized for his contributions to enhancing national industrial competitiveness through initiatives such as fostering global leadership in materials and components, leading production innovation based on AX technology, and promoting domestic equipment manufacturing. He also played a significant role in achieving cumulative exports of 80 trillion won from 2021 to 2025, contributing to the expansion of exports in the electronics and IT sector, which led to his selection for this year's Silver Tower Industrial Medal.
Since joining LG Innotek in 2004, Jo has been acknowledged as a 'production expert' and 'yield specialist' for elevating the quality and production competitiveness of the company's core businesses, including optical and package solutions, to a global level.
From 2017, he served as the head of the Vietnam production subsidiary and later as the head of the optical solution division until last year, where he led production innovations for mobile camera modules using AX technology.
Notably, he integrated AI throughout the entire process from camera module development to mass production, establishing an automated quality inspection and improvement system. Amid intensifying global competition, Jo maximized yields to industry-leading levels based on this AX production innovation, solidifying the global leadership of the camera module business. As of last year, LG Innotek's mobile camera module sales had increased more than 30 times compared to the early days of smartphones in 2010.
At the end of last year, Jo was appointed head of the Package Solution Division, which leads another key growth area for the company, the semiconductor substrate business. He was selected as the right person to drive both production line expansion and yield stabilization amid the surge in demand for high-value semiconductor substrates in the AI era.
LG Innotek offers high-value semiconductor substrate products, including Radio Frequency System in Package (RF-SiP) and Flip Chip Chip Scale Package (FC-CSP). The company is also aggressively expanding its new business in Flip Chip Ball Grid Array (FC-BGA) substrates.
To further close the technology gap in semiconductor substrates and enhance business competitiveness, Jo is pursuing large-scale investments to double production capacity. He recently announced a goal to grow the package solution business into a 1 trillion won operating profit business within five years.
Additionally, Jo has continued to invest in Gumi, North Gyeongsang Province, the production hub for LG Innotek's optical and package solutions, creating new jobs and contributing to regional economic revitalization.
He has also been recognized for investing nearly 80% of the funds in domestic equipment manufacturers during the optical equipment investment process, promoting the localization of key equipment and enhancing the competitiveness of the industrial ecosystem.
Jo expressed his gratitude, stating, "I am honored to receive this award on behalf of all LG Innotek employees who have dedicated their passion and efforts to securing differentiated technology and business competitiveness. I feel a heavy sense of responsibility and will continue to do my utmost to ensure LG Innotek's sustained growth as a global electronics and IT company representing South Korea."
* This article has been translated by AI.
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