Moon Hyuk-soo, CEO of LG Innotek, announced that the company expects to supply next-generation semiconductor glass substrates by 2028. He also expressed optimism about improving performance in the FC-BGA (Flip Chip Ball Grid Array) business, which involves high-value semiconductor packaging, as the company expands long-term supply contracts with major global tech firms.
Speaking with reporters on October 13 at the Korea Electronics Show (KES) 2026 in Seoul, Moon stated, "We believe it will be possible around 2028" regarding the supply timeline for glass substrates. He added, "We are currently operating a pilot production line at our Gumi facility," clarifying that the project is still in the development stage, not yet at the supply stage.
Since officially entering the glass substrate market in 2024, LG Innotek has established a pilot production line at its Gumi facility and is collaborating with global tech giants on prototype development and reliability testing. Moon's comments reaffirm the previously set goal of mass production by 2028.
Glass substrates are a next-generation semiconductor packaging solution that replaces traditional plastic materials. They are less prone to deformation from heat and are advantageous for implementing fine circuits, making them attractive for high-performance artificial intelligence (AI) semiconductor applications. However, challenges such as the risk of glass breakage and high processing complexity must be addressed for commercialization.
Regarding the FC-BGA business, Moon expects visible results starting next year. He noted, "We are continuing to sign long-term supply agreements (LTAs) with big tech companies," and expressed optimism for improvements beginning next year. When asked about specific clients, he replied, "You all know the companies."
FC-BGA serves as a packaging substrate that connects high-performance semiconductors, such as CPUs and GPUs, to motherboards. Demand is increasing due to investments in AI servers and data centers.
Since entering the FC-BGA market in 2022, LG Innotek has expanded its production line at the Gumi facility. Recently, the company has broadened its product range from traditional CPU substrates for PCs to include substrates for AI server networks and learning and inference applications. The strategy aims to secure stable demand through long-term supply contracts with global clients while increasing the proportion of high-value products to enhance profitability.
Meanwhile, Moon stated that the company's robotics-related business is currently in the research and development (R&D) stage, and he refrained from discussing specific commercialization plans.
* This article has been translated by AI.
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