LG Electronics is collaborating with GS Construction and the U.S. immersion cooling specialist GRC to develop immersion cooling technology for artificial intelligence (AI) data centers. This partnership aims to expand the cooling solutions for AI data centers by adding immersion cooling to existing air and liquid cooling methods.
On October 13, LG Electronics announced that it signed a memorandum of understanding with GS Construction and GRC at GS Construction's headquarters in Jongno, Seoul, to develop data center immersion cooling technology and equipment.
The three companies will validate the practical application of immersion cooling technology in AI data centers and jointly develop integrated solutions and standard designs. This effort goes beyond merely testing the performance of cooling equipment; it will also review the design of data centers, including building structures, piping, power infrastructure, and maintenance space.
Immersion cooling involves submerging electronic devices such as GPUs and CPUs in a special non-conductive cooling fluid to dissipate heat. As AI computations increase, leading to higher server heat generation, this next-generation method is gaining attention as a complement to traditional air cooling.
LG Electronics will provide air, liquid, and immersion cooling technologies along with operational data to build cooling solutions tailored to standard designs. GS Construction will be responsible for the standard design of AI data center construction and pre-validation test beds. GRC will supply immersion tanks and control technologies and participate in system improvements based on installation and operational data.
LG Electronics already has air cooling technology using chillers and fan wall units, as well as liquid cooling solutions utilizing cooling distribution units (CDUs) and cold plates. Through this collaboration, the company plans to validate the performance and reliability of immersion cooling to establish a cooling portfolio that meets the specific requirements of AI data centers.
O Se-gi, Vice President and Head of LG Electronics' ES Research Institute, stated, "We will continue to research and develop high-performance, high-efficiency cooling solutions to seize the rapidly growing market for AI data center cooling solutions."
* This article has been translated by AI.
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