SEOUL, December 04 (AJP) - SK hynix said Thursday it has created a dedicated high-bandwidth memory (HBM) unit to provide faster technical support and bolster market responsiveness in North America.
It also established a new team responsible for HBM packaging, quality and yield management across development and mass production.
The move is aimed at reinforcing its position in the global AI era and ensure sustainable growth, the company said.
The company also plans to establish “Global AI Research Centers” in the United States, China and Japan. The U.S. center will focus on recruiting top-tier talent and expanding collaboration with major global technology firms to advance next-generation computing system architectures.
Construction of an advanced packaging fab in Indiana will proceed this year, while a new “Global Infra” team will work to strengthen production consistency across global sites.
The chipmaker will also set up a “Macro Research Center” to analyze global economic and geopolitical developments shaping AI and semiconductor strategies, and operate an “Intelligence Hub” that integrates customer, technology and market data using AI tools to better anticipate client needs.
“This restructuring is an essential step toward becoming a full-stack AI memory creator and strengthening our competitiveness as a leading global company,” CEO Kwark No-jung said in a press release.
* This article, published by Aju Business Daily, was translated by AI and edited by AJP.
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