As of 9:33 a.m. on June 16, shares of Genersem were trading at 6,480 won, up 600 won (10.20%) from the previous trading day, according to the Korea Exchange.
Genersem disclosed that it signed a supply contract with SK Hynix worth 7.369 billion won. This contract represents 12.98% of the company's consolidated revenue from the previous year, and the contract period extends until September 28.
Specializing in automation equipment for semiconductor backend processes, Genersem reported consolidated revenues of 56.8 billion won and an operating profit of 1 billion won last year.
Market analysts are also noting the potential benefits from increased investments in high-bandwidth memory (HBM) backend processes.
Inahyeon Lee, a researcher at the Korea Investor Relations Association, stated, "With the resumption of HBM backend investments and the reflection of deferred demand, a turnaround in performance is expected in 2026. The order backlog at the end of the first quarter was 42.5 billion won, and new orders for backend equipment from new clients and HBM-related equipment from major domestic memory customers will enhance visibility for revenue recovery."
Lee added, "The demand for automation equipment, including bonding, mounting, transport, sorting, and sewing, is increasing due to the expansion of HBM high-density packaging and advanced packaging. The internalization of hybrid bonders could serve as a long-term growth driver."
* This article has been translated by AI.
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