SEOUL, November 02 (AJP) - SK hynix has launched a new U.S. business division headed by its chief technology development executive, stepping up efforts to strengthen ties with American tech giants as demand for customized AI memory chips accelerates.
The new Americas headquarters began operations Sunday under President Ahn Hyun, who has overseen the development of high-bandwidth memory (HBM) and other advanced memory products, according to industry sources.
The move elevates SK hynix's U.S. operations to a president-level organization, reflecting the growing importance of American customers to its business.
U.S. sales reached 84.56 trillion won in the first half of 2026, accounting for 64.1 percent of total revenue and more than tripling from a year earlier.
The restructuring comes as demand shifts toward customized HBM products, requiring closer collaboration with customers from the early stages of AI chip design through development and qualification.
SK hynix is also expanding its U.S. manufacturing footprint, having broken ground in August on a roughly $4 billion advanced packaging facility in West Lafayette, Indiana. The plant is scheduled to begin mass production in the second half of 2029.
The company has partnered with Purdue University on next-generation HBM research and testing, seeking to integrate local development with advanced packaging capabilities.
SK hynix expects fourth-quarter shipments of HBM4 to surpass those of HBM3E as it transitions to the next generation of AI memory chips.
The new U.S. division is expected to play a central role in coordinating product development and customer qualification with major American technology companies.
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