Seoul has successfully attracted Henkel, a global adhesive and electronic materials company from Germany, to establish a semiconductor advanced packaging materials research and development (R&D) center in the Gasan Digital Complex. Henkel plans to invest 12.1 billion won in foreign direct investment (FDI) by 2031 and will hire 15 specialized researchers, including those with master's and doctoral degrees.
On November 9, the Seoul Metropolitan Government announced that it signed a memorandum of understanding with Henkel to establish the semiconductor packaging materials R&D center. The signing ceremony was attended by Kim Hyun-woo, head of the Seoul Economic Office, and Kim Young-mi and Jang Ho-jun, co-CEOs of Henkel Korea.
The research center will be part of the 'Henkel Technology Center Korea' being developed in the Gasan Digital Complex, utilizing 1,205 square meters of the total 5,112 square meters for semiconductor packaging materials research. Henkel aims to consolidate its existing R&D functions scattered across the country into Seoul and establish new research capabilities for AI semiconductors and next-generation high-bandwidth memory (HBM) materials.
Semiconductor packaging technology protects chips and connects them to other components to enhance performance. In products like HBM, which stack multiple chips, materials that securely bond the chips and dissipate heat generated during operation are crucial. Henkel plans to develop liquid molding underfill (L-MUF) to protect and secure chips, thermal materials to transfer heat externally, and bonding materials to enhance the structural stability of packages.
Through the Seoul research center, Henkel will develop materials tailored to the specifications required by domestic semiconductor companies and expand joint research and technical support. The Seoul government aims to broaden the domestic R&D base for key materials and promote cooperation for material localization and supply chain stabilization. The agreement also includes training young researchers in collaboration with domestic universities and research institutions. The city plans to discuss investment incentives under the Foreign Investment Promotion Act with the Ministry of Trade, Industry and Energy.
Founded in Germany in 1876, Henkel operates in 79 countries worldwide, specializing in adhesives, electronic materials, and consumer goods. Last year, its consolidated revenue was approximately 20.5 billion euros. Henkel Korea, which is wholly owned by Henkel, operates manufacturing and research facilities in Seoul, Cheonan, Incheon, Eumseong, and Busan, having invested around 87.6 billion won in domestic R&D and advanced materials production facilities.
Jang Ho-jun, co-CEO of Henkel Korea, stated, "Through this investment in the R&D center, we will strengthen our technological competitiveness in AI and HBM semiconductor packaging materials and expand collaboration with the domestic semiconductor industry ecosystem."
Kim Hyun-woo, head of the Seoul Economic Office, emphasized, "To maintain competitiveness in the AI semiconductor and HBM markets, developing key material technologies and securing a stable supply chain is essential. This attraction can lead to technological cooperation with domestic semiconductor companies and the creation of research jobs."
On November 9, the Seoul Metropolitan Government announced that it signed a memorandum of understanding with Henkel to establish the semiconductor packaging materials R&D center. The signing ceremony was attended by Kim Hyun-woo, head of the Seoul Economic Office, and Kim Young-mi and Jang Ho-jun, co-CEOs of Henkel Korea.
The research center will be part of the 'Henkel Technology Center Korea' being developed in the Gasan Digital Complex, utilizing 1,205 square meters of the total 5,112 square meters for semiconductor packaging materials research. Henkel aims to consolidate its existing R&D functions scattered across the country into Seoul and establish new research capabilities for AI semiconductors and next-generation high-bandwidth memory (HBM) materials.
Semiconductor packaging technology protects chips and connects them to other components to enhance performance. In products like HBM, which stack multiple chips, materials that securely bond the chips and dissipate heat generated during operation are crucial. Henkel plans to develop liquid molding underfill (L-MUF) to protect and secure chips, thermal materials to transfer heat externally, and bonding materials to enhance the structural stability of packages.
Through the Seoul research center, Henkel will develop materials tailored to the specifications required by domestic semiconductor companies and expand joint research and technical support. The Seoul government aims to broaden the domestic R&D base for key materials and promote cooperation for material localization and supply chain stabilization. The agreement also includes training young researchers in collaboration with domestic universities and research institutions. The city plans to discuss investment incentives under the Foreign Investment Promotion Act with the Ministry of Trade, Industry and Energy.
Founded in Germany in 1876, Henkel operates in 79 countries worldwide, specializing in adhesives, electronic materials, and consumer goods. Last year, its consolidated revenue was approximately 20.5 billion euros. Henkel Korea, which is wholly owned by Henkel, operates manufacturing and research facilities in Seoul, Cheonan, Incheon, Eumseong, and Busan, having invested around 87.6 billion won in domestic R&D and advanced materials production facilities.
Jang Ho-jun, co-CEO of Henkel Korea, stated, "Through this investment in the R&D center, we will strengthen our technological competitiveness in AI and HBM semiconductor packaging materials and expand collaboration with the domestic semiconductor industry ecosystem."
Kim Hyun-woo, head of the Seoul Economic Office, emphasized, "To maintain competitiveness in the AI semiconductor and HBM markets, developing key material technologies and securing a stable supply chain is essential. This attraction can lead to technological cooperation with domestic semiconductor companies and the creation of research jobs."
* This article has been translated by AI.
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