Samsung Electronics adds AMD on HMB4 client list after Nvidia

by Candice Kim Posted : March 18, 2026, 17:32Updated : March 18, 2026, 17:32
AMD CEO Lisa Su inspects facilities at the Pyeongtaek fabrication plant on March 18 Courtesy of Samsung Electronics
AMD CEO Lisa Su inspects facilities at the Pyeongtaek fabrication plant on March 18/ Courtesy of Samsung Electronics

SEOUL, March 18 (AJP) - Samsung Electronics added AMD after Nvidia on its burgeoning client list for next-generation high bandwidth memory dubbed HBM4, gaining traction in the crucial in HBM race move to inference AI stage.

  

A memorandum of understanding (MOU) with U.S. chip designer AMD to expand strategic partnership in next-generation AI memory and computing technologies was signed at Samsung’s Pyeongtaek campus.

 

Under the terms of the agreement, Samsung will supply its advanced HBM4 solutions for AMD’s next-generation "Instinct MI455X" GPUs. The collaboration also extends to providing next-generation DDR5 memory for AMD’s EPYC server processors and its "Helios" data center platform. This move is seen as a strategic effort by both companies to diversify the AI semiconductor supply chain, which is currently seeing intense competition for high-capacity memory.

 

"Powering the next generation of AI infrastructure requires deep collaboration across the industry," said Lisa Su, Chair and CEO of AMD. "We are thrilled to expand our work with Samsung, bringing together their leadership in advanced memory with our Instinct GPUs, EPYC CPUs and rack-scale platforms. Integration across the full computing stack, from silicon to system to rack, is essential to accelerating AI innovation that translates into real-world impact at scale.”

 

Samsung Vice Chairman Jun Young-hyun emphasized the company’s "turnkey" capabilities, which integrate memory, foundry, and advanced packaging services under one roof. The two companies also discussed potential cooperation in semiconductor foundry services, leveraging Samsung’s advanced process technology to manufacture future AMD products. This deal marks a significant expansion of a 20-year partnership that began with graphics memory in 2007.

 

On Tuesday, Samsung showed off its sixth-generation HBM4 being mass produced at Pyeongtaek at Nvidia's GTC 2026 as it a provider of a comprehensive memory and storage solution the U.S. top GPU maker's next-generation Vera Rubin platform. 

 

Samsung Electronics DS Division Head Young Hyun Jun R and AMD CEO Lisa Su pose for a photo after signing an MOU at the Pyeongtaek fab Courtesy of Samsung Electronics
Samsung Electronics DS Division Head Young Hyun Jun (R) and AMD CEO Lisa Su pose for a photo after signing an MOU at the Pyeongtaek fab/ Courtesy of Samsung Electronics