LG Electronics is enhancing its global market strategy by introducing modular cooling solutions designed to reduce the construction time and initial investment burden of artificial intelligence (AI) data centers. The company aims to expand its business scope from cooling equipment to include the design and operation of AI data centers by integrating LG Energy Solution's batteries and LG CNS's data center construction capabilities.
On September 29, LG Electronics announced its participation in Asia's largest data center exhibition, Data Center World Asia (DCWA) 2026, held in Singapore, where it showcased solutions encompassing thermal management, power, and operations for AI data centers.
Among the innovations presented was the 'Hydronic Modular' system, a pre-fabricated solution that combines pumps, valves, and emergency buffer tanks into a single unit. This design allows for quick installation on-site by simply connecting chillers and piping, thereby reducing construction time for data centers. Additionally, the modular system can be expanded as needed to accommodate server upgrades.
LG Electronics also displayed large cooling equipment, including air-cooled, oil-free inverter turbo chillers and fan wall units. In the liquid cooling sector, the company introduced 1MW and 2.6MW cooling distribution units (CDUs). LG is expanding its 'chip to chiller' cooling portfolio, which connects chillers to CDUs and cold plates.
On September 27, LG Electronics was selected as a partner in the power and cooling sectors of NVIDIA's official partner program, the NVIDIA Partner Network. This designation positions LG to directly expand its reach within NVIDIA's AI data center ecosystem.
The exhibition also highlighted the 'One LG' solution, which combines the capabilities of group affiliates. LG Energy Solution showcased battery backup units and energy storage systems (BESS) for data centers, while LG CNS presented a prefabricated modular data center that allows for on-site assembly of servers and power and cooling equipment.
LG Electronics plans to extend its role beyond supplying individual cooling equipment to become an infrastructure partner that collaborates with customers throughout the design, manufacturing, transportation, construction, operation, and expansion of data centers. This strategy responds to the growing demand for integrated cooling and power systems as the power density of AI servers increases.
Lee Jae-sung, President of LG Electronics' Energy Solutions Business Division, stated, “We will leverage our total cooling solutions optimized for ultra-large AI data centers to become a key partner in the global AI infrastructure market.”
* This article has been translated by AI.
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