SEOUL, November 27 (AJP) - Samsung Electronics announced on Thursday it is dissolving its standalone high bandwidth memory development team created last year and moving related personnel back under the DRAM development division.
The HBM development team will be absorbed into the design team under the DRAM development division, with Vice President Son Young-soo, who led the HBM team, appointed as head of the design team.
Samsung created the dedicated HBM development team in July 2024, about a month after Executive Vice President Jun Young-hyun was appointed head of the Device Solutions division. The move came as Samsung lost ground to SK Hynix in the HBM market.
The reorganization after about one year suggests confidence in securing technology for next-generation HBM products including HBM4. HBM team personnel will continue developing HBM4 and HBM4E products under the design team.
Samsung has recently built partnerships with major tech companies including Nvidia, AMD, OpenAI and Broadcom in HBM. The company ranked third in the HBM market in the second quarter this year.
Market research firm TrendForce expects Samsung to achieve more than 30 percent market share in the global HBM market in 2026 based on expanded HBM4 supply.
Samsung plans to complete the reorganization this week and hold a global strategy meeting in early December to review next year's business plans.
reporter
Candice Kim
candicekim1121@ajupress.com
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